Sec-160# single liquid acid etching solution

2019-09-23 533

1、 Introduction

SEC-160
#It is a new type of single liquid acid etching solution, which has the characteristics of simple control, low hydrochloric acid content, fast etching rate and high copper dissolution. The drug solution has excellent stability and small side corrosion. It can be applied to all acid copper chloride etching control systems (including the inner layer of multilayer board). Mainly used for:
1. Replace hydrogen peroxide or chlorate to avoid danger.
two. Replace ferric chloride to avoid environmental pollution.
3. Replace the acid etching salt, simplify the control method and improve the stability of etching.
4. Replace pure hydrochloric acid etching to improve the etching speed and quality.

In the current circuit board industry, the traditional etching method is ferric chloride etching
,Hydrochloric acid etching,hydrochloric acid+Regenerant (hydrogen peroxide, etching salt, chlorate solution), ammonia+蚀刻盐。其中氨water+蚀刻盐及hydrochloric acid+It can be used in any ordinary way, so it can be used in any board regeneration system.
The company has been engaged in the development and production of etching solution for many years. On the basis of absorbing the experience of peers and repeated tests, the company has developed a new generation of etching solution—SEC-160#。 The etching solution has the advantages of stable composition, high copper etching rate, fast etching speed and less pollution. In particular, it contains no oxidant, single liquid type and is very easy to control. It can be used in all acidic copper chloride etching systems (including automatic systems).


Cost accounting 1two0 kg copper corrosion 1two0 kg copper corrosion

hydrochloric acid1000千克 SWE-two60#900-1000千克

Hydrogen peroxide (50%) uses 100-two00kg of water, and the electricity consumption is about 10-two0% less than that of hydrogen peroxide

The etching speed of electricity and water is 10-two0% faster than that of hydrogen peroxide


Conclusion: To sum up, sec-160# environmental friendly acidic etching solution is an ideal etching solution.


two、 Operating conditions:

Copper ion 1two0-140 g / L

Chloride ion 160-180 g / L

Temperature 40-500c

PH value 0.5-1.5

Baume degrees two4-two8


3、 Usage and solution control:

It can be added automatically or manually.

Manual: first drain 1 / 5-1 / 4 mother liquor, and then add the same amount of make-up liquid.

Automatic: adjust the specific gravity control toBetween two5-two7 º be, lower specific gravity can obtain faster etching speed. Refer to the equipment manual for the adjustment method.
When preparing the tank, add the following components into the water in sequence, and the solid materials must be completely dissolved:


form

Concentration

Copper chloride (CuCltwo • twoHtwoO)

350-400g/L

hydrochloric acid (HCl)31%

180-two00ml/L

SWE-two60#

two80-300ml/L

water

Margin


However, in the actual operation, it is not necessary to prepare the tank according to the above method, but use the existing acidic copper chloride etching waste liquid (Baume degree is not less than)two5 degrees) add sec-160#, prepared working fluidtwotwo-two4 Baume degrees, sec-160#Add no less thantwo0%即可。通常将该等蚀刻废液称为母液,各种酸性氯化铜的蚀刻废液(ashydrochloric acid-双氧water、hydrochloric acid-氯酸盐或hydrochloric acid-催化剂型的蚀刻废液)均可作为SEC-160#Mother liquor of acid etching solution.


4、 Maintenance:

because
SEC-160#酸性蚀刻液中hydrochloric acid浓度较低,对杂质的溶解力不ashydrochloric acid-双氧water型蚀刻液强,应尽量避免蚀刻液受污染。需每天清洗过滤网,同时留意喷嘴是否堵塞,蚀刻机15-30天清洗一次。


5、 Safety, storage and transportation:

本品具有腐蚀性,操作时需穿保护衣物及戴上手套。as不慎接触皮肤及眼睛,必须用大量清water冲洗,严重时要送医院治疗。
It shall be packed in closed plastic containers and stored in a cool place without direct sunlight.


6、 Troubleshooting:

SEC-160
#The acid etching solution is quite stable. Under normal circumstances, the etching can be carried out quickly and stably only by controlling the density of the working solution. In case of poor control, the faults and troubleshooting methods are as follows:
1. Slow etching speed
It is usually caused by low temperature or spray pressure. Under normal conditions, the copper content may be too high or too low. According to the specific situation1) Supplement sec-160#Reduce density totwo4ºBe。 two) Add high concentration mother liquor or etching waste plate until the copper content is normal.
two. Precipitation of working fluid
可能是铜含量过高或hydrochloric acid含量不足。铜含量过高时还伴随蚀刻速度变慢、溶液粘度增加等现象,按前款之1)处理。hydrochloric acid含量不足可根据化验结果补充hydrochloric acid。
3. Irregular brown patches appear on the board
这是hydrochloric acid含量不足所致。用稀hydrochloric acid溶液清洗,可发现斑块下是未被蚀刻掉的铜。产生这种现象,蚀刻液中hydrochloric acid含量仅有3-5%, to be supplemented to 7-8%.
4. The resist is damaged
hydrochloric acid含量及温度过高,造成线路蚀刻不整齐(锯齿状)。
板子在用water洗时,残留在板上的工作液出现白色混浊(可被water洗去)属正常现象。


7、 Cost accounting:

Sec-160# service conditions:

Temperature: 45-55 ℃

Density: two4-two6 º be

Spray pressure: two.two-two.5kg/cmtwo

Etching speed: twom / min

Copper foil thickness: H / 0

Under the above conditions, per ton
SEC-160#Acid etching solution (tax included)1two00 / ton) about 1two00m of etchable copper platetwoTo produce copper corrosion waste liquid1two00Kg(以不含税价900/吨计),其材料成本as下式:1*1two00/1.17-1.two*900)/1two00 = -0.045元/Mtwo
If the copper etching waste liquid cannot be sold, the company can provide it on behalf of the company1: 1 exchange sec-160#Acid etchant service. The material cost is zero.
asSEC-160#If the use conditions change, the cost will also change.