1、 Overview

1. The effect of soldering aid is good, and the wettability of tin alloy layer is good.
2. The lead and tin on the surface of the printed board are uniform, smooth and bright, and have good adhesion with the bottom layer.
3. The board surface is easy to be washed with water, and there is less spray in the washing process.
4. The phenomenon of lead-free tin bridge connection between thin lines is suitable for surface mount technology.
5. Strong adhesion with copper surface, suitable for vertical and horizontal tin spraying process.
6. It does not contain flammable and volatile substances. It is safe to use and does not need to add diluent.
7. Low acidity, no damage to the wind knife.
8. There are few residual substances, which does not affect the component content of the tin furnace.

2、 Technical indicators

Colorless or light yellow viscous liquid

PH value 1.0-2.0

Specific gravity (g / cm) ³） 1.05±0.02

3、 Process conditions

Bath temperature 240-280 ℃

Hot air temperature 190-230 ℃

Air pressure 0.3-0.5mpa

Tin dipping time 3-6s

4、 Use and maintenance

1. Printed boards must be cleaned before applying flux.

2. Directly use h-382# stock solution to coat the plate surface, roll coating, soaking or spray coating.

3. The tin cylinder should have appropriate surface protection, high-temperature oil, and copper impurities should be treated periodically.

4. The workplace must be ventilated.

5、 Packaging and storage

Packaging: 20 liters or customer requirements;

Storage: it is not a hazardous chemical, and it shall be stored indoors at room temperature according to the requirements of ordinary liquid chemicals;

Period of validity: six months.